System No. F-C-2193

F Rating — 1 Hr

T Rating — 3/4 Hr

1. Floor-Ceiling Assembly The 1 hr fire-rated wood joist floor-ceiling assembly shall be constructed of the materials and in the manner specified in the individual L500 Designs in the UL Fire Resistance Directory, as summarized below:

A. Flooring System Lumber or plywood subfloor with finish floor of lumber, plywood or Floor Topping Mixture* as specified in the individual Floor-Ceiling Design. Max diam of floor opening is 3-1/4 in.

B. Wood Joists Nom 10 in. deep (or deeper) lumber, steel or combination lumber and steel joists, trusses or Structural Wood Members* with bridging as required and with ends firestopped.

C. Wallboard, Gypsum* Nom 5/8 in. thick as specified in the individual Floor-Ceiling Design. Wallboard secured to joists as specified in the individual Floor-Ceiling Design. Max diam of opening is 3-1/4 in.

2. Through Penetrants One nonmetallic pipe to be installed either concentrically or eccentrically within the firestop system. Diam of the circular opening in flooring, and top and sole plates of chase wall is 5/8 or 7/8 in. larger than the actual diam of the pipe or pipe coupler such that the annular space is min 0 in. (point contact) to max 7/8 in. Pipe to be rigidly supported on both sides of floor-ceiling assembly. The following types and sizes of nonmetallic pipes may be used:

A. Polyvinyl Chloride (PVC) Pipe Nom 2 in. diam (or smaller) Schedule 40 cellular or solid core PVC pipe for use in closed (process or supply) or vented (drain, waste or vent) piping system.

B. Chlorinated Polyvinyl Chloride (CPVC) Pipe Nom 2 in. diam (or smaller) SDR17 CPVC pipe for use in closed (process or supply) or vented (drain, waste or vent) piping systems.

3. Firestop System The firestop system shall consist of the following:

A. Packing Material Foam backer rod firmly packed into opening as a permanent form. Packing material to be recessed from top surface of subfloor as required to accommodate the required thickness of fill material.

B. Fill, Void or Cavity Material* — Caulk Min 1/4 in. thickness of fill material applied within annulus, flush with top surface of subfloor. At point contact location, a min 1/4 in. diam bead of fill material shall be applied to the penetrant/plywood interface on top surface of floor assembly. Min 1/2 in. thickness of fill material applied within annulus, flush with bottom surface of ceiling. At point contact location, a min 1/4 in. diam bead of fill material shall be applied to the penetrant/gypsum board interface on bottom surface of ceiling. RECTORSEAL — Biostop 500+